Semiconductor manufacturing processes such as lithography, etching, and metal deposition could affect the electrical properties of pristine thin film materials. Xallent’s direct-probing solutions address these problems by enabling researchers and yield engineers to gain early actionable insights into material properties, boost confidence levels in collected data, reduce manufacturing costs, and accelerate the achievement of research and commercialization objectives.

Xallent’s micro and nanoscale four point probes directly measure the sheet resistance, 4-wire resistance, and I/V properties of thin film materials. Xallent’s nanoscale resolution even makes it possible to investigate how grain sizes, boundaries, defects, and material composition impact those measurements. Using that detailed information, researchers can quickly optimize material production, reliability, and yield.

Combined with the Xallent SAKYIWA XS-10 NanoProber, the four point probes allow for quick sheet resistance mapping at the micro and nanoscale level.