Skip to content 
Welcome to the new frontier in semiconductor tests
Gain early actionable insights into chiplet manufacturing and advanced packaging with fine pitch probing solutions
Advances in artificial intelligence, high performance computing, and high bandwidth memory will transform our lives. Advanced computing chips are being developed which will lead to profound societal and commercial impacts.
Let’s explore the nanoscale together
Our fine pitch probing technologies provide the early actionable insights needed during new materials development and chip manufacturing. Determine potential process variations which could significantly reduce chip design costs by 25%, shorten manufacturing iterations by 10X, and accelerate time-to-market by up to 3 months.
A new world for a world of tests
A simpler, faster, and more reliable solution to characterize chiplets, advanced packages, and thin films. Developed in partnership with MPI Corporation, HITS™ sets a new standard in semiconductor and materials testing.
Technology Development Partners
