As the semiconductor industry adopts 2.5D and 3D heterogeneous integration to extend Moore’s Law, chiplets have become the building blocks of next-generation performance. By integrating miniature integrated circuits with specialized functions, chiplets offer optimized power, lower manufacturing costs, and unparalleled scalability. However, this complexity demands perfection; systematic or random faults during manufacturing can persist across batches, devastating yields and inflating packaging costs. Ensuring a “Known-Good Die” is no longer optional—it is a baseline requirement.