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Heterogeneous Integration Test System (HITS™)
ONE HITS – Unified Test System
The Heterogeneous Integration Test System (HITS™) is our premier semi-automatic solution for chiplet, advanced package, and thin-film characterization. Developed in partnership with MPI Corporation, HITS™ advances the state-of-the-art in advanced package testing. By combining Xallent’s patented fine-pitch probe cards and proprietary automation software with MPI’s elite probing platforms, the system delivers early, actionable insights that accelerate R&D and secure high-volume manufacturing yields. Designed for maximum versatility, HITS™ seamlessly supports individual dies, small-form-factor pieces, and full-wafer testing across 100 mm, 200 mm, and 300 mm formats.
“This partnership leverages MPI’s expertise in automated probing systems and Xallent’s patented fine pitch probe cards and advanced software. Together, these technologies create a unified platform that enables precise, high-throughput testing of chiplets and advanced packages. By combining MPI’s reliable automation and Xallent’s innovative probing solutions, the HITS™ empowers customers to achieve greater accuracy, faster results, and cost efficiencies in chiplet and heterogeneous integration development. We are pleased to strengthen our strategic partnership with Xallent and to continue our joint efforts to innovate and accelerate the development of next-generation AI chips.”
Dr. Stojan Kanev, General Manager, MPI-Advanced Semiconductor Test Division.
Nanoscale resolution of the HITS enables the probing of chiplets with fine pitch microbumps and hybrid bond pads
Leveraging powerful computer vision algorithms to guide the probing sequence, HITS™ reduces operational overhead by targeting only viable devices. Both probe card longevity and measurement precision are significantly enhanced through proactive defect avoidance, which prevents fine-pitch tips from making contact with surface particles or localized contaminants. To support these capabilities, we offer a versatile portfolio of fine-pitch solutions—including 4-point, parametric, and custom probes—engineered for the industry’s most demanding applications.
Applications
Kelvin Resistance Measurements: Execute high-fidelity Kelvin and sheet resistance measurements on microbumps, copper pillars, and hybrid bond pads with sub-micron precision.
Parametric Testing: Implement robust process control monitoring (PCM) across both chiplet manufacturing and advanced assembly workflows.
Functional Validation: Validate chiplet functionality both prior to singulation and after final assembly to ensure Known-Good Die (KGD) status.
Defect Inspection: Utilize advanced computer vision algorithms to identify and isolate faulty hybrid bond pads and microbumps before they impact yield.
Specifications
- Supports up to 300 mm wafers and pieces
- Vision system with sub-1 µm resolution
- Accepts fine pitch probe cards
- Autofocus and light intensity adjustment
- Utilizes control & feedback algorithms to bring probe tips into contact with wafer
- Leverages optical inspection data to guide electrical tests
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