Developing next-generation Heterogeneous Integration (HI) technologies requires tunable design parameters to achieve optimal performance. However, legacy test pads—limited by a standard pitch of ~100 µm—restrict the number of devices that can be integrated into a single test chip. This physical constraint leads to insufficient test coverage, forcing engineers into redundant design and manufacturing cycles.

Xallent’s fine-pitch parametric probes shatter this bottleneck by enabling a 10x reduction in pad pitch. By shrinking the test footprint, we empower researchers to:

• Maximize Die Density: Dramatically increase the number of testable devices per wafer.

• Optimize Yield & Reliability: Achieve superior test coverage for high-fidelity performance data.

• Lower Operational Costs: Reduce the total cost-per-die through more efficient wafer utilization.

• Accelerate R&D: Shorten learning cycles and expedite time-to-market.