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Heterogeneous Integration Test System
Unlock the Power of the Heterogeneous Integration Test System (HITS)
The semiconductor industry is adopting 2.5D and 3D heterogeneous integration of chiplets to advance Moore’s Law. A chiplet represents a miniature integrated circuit (IC) with distinct set of functions. They offer optimized performance and power, lower manufacturing costs, higher flexibility and scalability resulting in expedited time-to-market. It is imperative that chiplets are faultless as systematic and random faults during manufacturing could persist across multiple batches, with negative impact on yields, manufacturing and packaging costs, and time-to-market.
The heterogeneous integration test system (HITS) is a semi-automatic test system for chiplet, advanced package, and thin film material tests. HITS leverages a portfolio of our fine pitch probe cards and automation software to more rapidly provide early actionable insights during chiplet manufacturing, advanced packaging, and new material development. HITS supports the following wafer sizes: 300 mm, 200 mm, 100 mm, and pieces.
Reduce capital expenditure with a single tool for inspection, metrology, and probing
Nanoscale resolution of the HITS enables the probing of chiplets with fine pitch microbumps and hybrid bond pads
By leveraging powerful computer vision algorithms to guide the probing sequence, the HITS reduces testing costs via testing only viable devices. Probe card lifetime and measurement accuracy is improved by virtue of avoiding fine pitch probe tips from making contact to particles or defects on test pads. We offer a portfolio of fine pitch probes (i.e., 4-point probes, parametric probes, and custom probes) to meet various demanding applications.
Applications
- Kelvin Resistance Measurements: Perform true Kelvin and sheet resistance measurements on microbumps, copper pillars, and hybrid bond pads
- Parametric Tests: Process control monitoring of chiplet manufacturing and assembly processes
- Functional Tests: Test the functionality of chiplets prior to singulation and after assembly
- Defect Inspection: Leverage computer vision algorithms to identify faulty hybrid bond pads and microbumps
Specifications
- Supports up to 300 mm wafers and pieces
- Vision system with sub-1 µm resolution
- Accepts fine pitch probe cards
- Autofocus and light intensity adjustment
- Utilizes control & feedback algorithms to bring probe tips into contact with wafer
- Leverages optical inspection data to guide electrical tests
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