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Fine Pitch Four Point Probes
Probe the future — Skip the pads
Modern semiconductor characterization is often limited by the physical size of the hardware. Traditional probes require large, dedicated landing pads that consume wafer space and necessitate complex lithography. Xallent’s MEMS-based probes redefine these limits. With pitches ranging from 10 µm down to sub-1 µm, our technology allows you to land directly on active device features or pristine thin films. By eliminating the need for sacrificial test pads, we provide a direct path to electrical data—minimizing preparation and maximizing your R&D velocity.
Xallent’s four-point probes provide a transformative solution for materials engineering organizations and researchers by addressing the most significant barriers in nanoscale metrology:
Minimal Sample Preparation: Direct-contact probing eliminates the need for the expensive and destructive lithographic, etching, and deposition cycles traditionally required to pattern metal electrodes. This allows for the immediate electrical characterization of thin films in their “pristine” native state.
Nanoscale Accessibility: The ultra-small form factor of our probes opens new frontiers in material science, enabling the rapid and effective testing of features at the micro and nanoscale that were previously unreachable by standard hardware.
High-Resolution Metrology: With fine-pitch spatial resolution, our probes reveal intrinsic surface conductivity distributions. This granular data allows for targeted process optimizations that directly improve device reliability and manufacturing yield.
Strategic Customization: We offer a versatile portfolio of probes tailored to specific research needs, including:
- Versatile Pitch Ranges: Probe spacings ranging from 500 nm to 1 mm.
- Material Matching: Customizable tip materials designed to match the work function of the material-under-test.
- Variable Contact Forces: Application-specific stiffness, including “soft-touch” probes for delicate 2D materials and high-force probes for penetrating passivation layers.
Xallent’s standard 10 µm pitch technology monolithically integrates four probes onto a single, robust consumable probe cartridge. By housing the cartridge in a specialized probe head assembly, the system can be navigated to the area of interest using a single set of high-precision positioners. Integrated with the HITS™ and SAKYIWA NanoProber platforms, Xallent’s four-point probes enable the rapid electrical characterization of sheet resistance and transistor performance across diverse thin-film materials.
Repeatable, accurate, and fast measurements enabled by our fine pitch four point probes
Applications
- IV
- Sheet resistance
- 4-wire Kelvin resistance
- Transistor Output & Transfer Curves
Specifications
- Number of tips: 4
- Arrangement: Inline
- Probe width: 5 µm ±1 µm
- Standard Pitch: 10 µm
- Probe-to-probe leakage current: ~500 pA @ 5 V
- Current carrying capacity: 100 mA
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