June 7, 2025 | ALBANY, NY –Xallent made a significant splash at SWTest 2025! We presented groundbreaking findings from our collaborative work with IBM on “Fine Pitch Probing of Micro-Bumps for Advanced Packages.” This project showcased the power of our 𝗳𝗶𝗻𝗲 𝗽𝗶𝘁𝗰𝗵 (𝟭𝟬 µ𝗺) 𝗞𝗲𝗹𝘃𝗶𝗻 𝗽𝗿𝗼𝗯𝗲𝘀 𝗮𝗻𝗱 𝗛𝗲𝘁𝗲𝗿𝗼𝗴𝗲𝗻𝗲𝗼𝘂𝘀 𝗜𝗻𝘁𝗲𝗴𝗿𝗮𝘁𝗶𝗼𝗻 𝗧𝗲𝘀𝘁 𝗦𝘆𝘀𝘁𝗲𝗺 (𝗛𝗜𝗧𝗦™), enabling us to precisely measure the resistance of individual micro-bumps on a 300mm wafer. This innovative probing solution delivers vital early insights into advanced packaging processes, directly contributing to maximized yields and a faster time-to-market for cutting-edge 𝗔𝗜 𝗰𝗵𝗶𝗽𝘀.