Xallent is developing testing solutions to support nanoscale characterization of semiconductor devices and thin film materials.
Conventional characterization and test methods are increasingly ineffective when applied to structures less than 100 nanometers, causing challenges across R&D, process control, and failure analysis. Given slow, complex detection processes, identification of subtle defects typically takes weeks or months following fabrication. This translates to significant waste as systemic issues can persist untreated across multiple batches. Xallent’s nanomachine probing technology directly addresses these challenges with simple, cost effective, and high speed testing solutions.
Xallent designs, develops, manufactures, and markets advanced nanoprobing solutions for imaging, electrical measurement, and testing of thin film materials and semiconductor devices. Our products enable on-wafer measurements and failure analysis of integrated circuits. Our products are also used for electrical, structural, chemical and mechanical characterization of thin film materials. Product design, manufacture, and assembly are conducted in Ithaca, New York.